A3PN010-1QN48
vs
A3PN010-1QNG48
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
Package Description |
6 X 6 MM, 0.90 HEIGHT, 0.40 MM PITCH, QFN-48
|
HQCCN,
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-XQCC-N48
|
S-XQCC-N48
|
Length |
6 mm
|
6 mm
|
Number of CLBs |
260
|
260
|
Number of Equivalent Gates |
10000
|
10000
|
Number of Terminals |
48
|
48
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
-20 °C
|
-20 °C
|
Organization |
260 CLBS, 10000 GATES
|
260 CLBS, 10000 GATES
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
HQCCN
|
HQCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG
|
CHIP CARRIER, HEAT SINK/SLUG
|
Peak Reflow Temperature (Cel) |
235
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.4 mm
|
0.4 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
20
|
|
Width |
6 mm
|
6 mm
|
Base Number Matches |
3
|
3
|
Moisture Sensitivity Level |
|
3
|
|
|
|
Compare A3PN010-1QN48 with alternatives
Compare A3PN010-1QNG48 with alternatives