A3PN125-VQG100I
vs
A3PN125-1VQ100
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100
|
14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
8 Weeks
|
8 Weeks
|
| Samacsys Manufacturer |
Microchip
|
|
| JESD-30 Code |
S-PQFP-G100
|
S-PQFP-G100
|
| Length |
14 mm
|
14 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Equivalent Gates |
125000
|
125000
|
| Number of Inputs |
71
|
|
| Number of Logic Cells |
3072
|
|
| Number of Outputs |
71
|
|
| Number of Terminals |
100
|
100
|
| Operating Temperature-Max |
100 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
-20 °C
|
| Organization |
125000 GATES
|
3072 CLBS, 125000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFQFP
|
TFQFP
|
| Package Equivalence Code |
TQFP100,.63SQ
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, THIN PROFILE, FINE PITCH
|
FLATPACK, THIN PROFILE, FINE PITCH
|
| Programmable Logic Type |
Field Programmable Gate Arrays
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Voltage-Max |
1.575 V
|
1.575 V
|
| Supply Voltage-Min |
1.425 V
|
1.425 V
|
| Supply Voltage-Nom |
1.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
14 mm
|
14 mm
|
| Base Number Matches |
1
|
2
|
| JESD-609 Code |
|
e0
|
| Number of CLBs |
|
3072
|
| Packing Method |
|
TRAY
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare A3PN125-VQG100I with alternatives
Compare A3PN125-1VQ100 with alternatives