A42MX36-1BG272MX79 vs A42MX36-2BG272 feature comparison

A42MX36-1BG272MX79 Microchip Technology Inc

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A42MX36-2BG272 Microsemi Corporation

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Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description PLASTIC, BGA-272 BGA,
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ALSO OPERATE AT 5.0V SUPPLY ALSO OPERATES AT 5V SUPPLY
Clock Frequency-Max 83 MHz 91 MHz
Combinatorial Delay of a CLB-Max 2.3 ns 2.1 ns
JESD-30 Code S-PBGA-B272 S-PBGA-B272
Length 27 mm 27 mm
Number of CLBs 1184 2438
Number of Equivalent Gates 54000 54000
Number of Inputs 202
Number of Outputs 202
Number of Terminals 272 272
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 1184 CLBS, 54000 GATES 2438 CLBS, 54000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA272,20X20,50 BGA272,20X20,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.5 mm 2.5 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
Base Number Matches 1 12
Rohs Code No
Part Package Code BGA
Pin Count 272
JESD-609 Code e0
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 225
Terminal Finish TIN LEAD SILVER
Time@Peak Reflow Temperature-Max (s) 20

Compare A42MX36-1BG272MX79 with alternatives

Compare A42MX36-2BG272 with alternatives