A5191HRTPG-XTD
vs
12197-508-XTP
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
AMI SEMICONDUCTOR
|
ON SEMICONDUCTOR
|
| Reach Compliance Code |
unknown
|
compliant
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
QLCC
|
| Package Description |
|
QCCJ,
|
| Pin Count |
|
28
|
| HTS Code |
|
8542.39.00.01
|
| Data Rate |
|
1 Mbps
|
| JESD-30 Code |
|
S-PQCC-J28
|
| JESD-609 Code |
|
e3/e4
|
| Length |
|
11.4808 mm
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
28
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
QCCJ
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
4.572 mm
|
| Supply Voltage-Nom |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Telecom IC Type |
|
MODEM
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
MATTE TIN/NICKEL PALLADIUM GOLD
|
| Terminal Form |
|
J BEND
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Width |
|
11.4808 mm
|
|
|
|
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