A54SX16A-1PQG208
vs
A54SX16A-FTQG144
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI CORP
|
ACTEL CORP
|
| Package Description |
FQFP, QFP208,1.2SQ
|
1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-144
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
|
| Additional Feature |
16000 TYPICAL GATES AVAILABLE
|
16000 TYPICAL GATES AVAILABLE
|
| Clock Frequency-Max |
263 MHz
|
167 MHz
|
| Combinatorial Delay of a CLB-Max |
1.2 ns
|
1.9 ns
|
| JESD-30 Code |
S-PQFP-G208
|
S-PQFP-G144
|
| JESD-609 Code |
e3
|
e3
|
| Length |
28 mm
|
20 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
1452
|
1452
|
| Number of Equivalent Gates |
24000
|
24000
|
| Number of Inputs |
175
|
113
|
| Number of Logic Cells |
1452
|
1452
|
| Number of Outputs |
175
|
113
|
| Number of Terminals |
208
|
144
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
1452 CLBS, 24000 GATES
|
1452 CLBS, 24000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FQFP
|
LFQFP
|
| Package Equivalence Code |
QFP208,1.2SQ
|
QFP144,.87SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.1 mm
|
1.6 mm
|
| Supply Voltage-Max |
2.75 V
|
2.75 V
|
| Supply Voltage-Min |
2.25 V
|
2.25 V
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
28 mm
|
20 mm
|
| Base Number Matches |
3
|
3
|
|
|
|
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