A54SX16A-FG256
vs
A54SX16A-FGG256
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROSEMI SOC PRODUCTS GROUP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
BGA
|
|
| Package Description |
LBGA,
|
|
| Pin Count |
256
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| Additional Feature |
16000 TYPICAL GATES AVAILABLE
|
|
| Combinatorial Delay of a CLB-Max |
1.4 ns
|
|
| JESD-30 Code |
S-PBGA-B256
|
|
| JESD-609 Code |
e0
|
|
| Length |
17 mm
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of CLBs |
1452
|
|
| Number of Equivalent Gates |
24000
|
|
| Number of Terminals |
256
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
1452 CLBS, 24000 GATES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LBGA
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.68 mm
|
|
| Supply Voltage-Max |
2.75 V
|
|
| Supply Voltage-Min |
2.25 V
|
|
| Supply Voltage-Nom |
2.5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
TIN LEAD/TIN LEAD SILVER
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
1 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
17 mm
|
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare A54SX16A-FG256 with alternatives