A54SX16A-FGG256A
vs
A54SX16A-FFG256I
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROSEMI SOC PRODUCTS GROUP
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
BGA
|
|
Package Description |
LBGA,
|
1 MM, FBGA-256
|
Pin Count |
256
|
|
Reach Compliance Code |
compliant
|
compliant
|
Additional Feature |
ALSO REQUIRES AN SUPPLU OF 3.3V
|
16000 TYPICAL GATES AVAILABLE
|
Combinatorial Delay of a CLB-Max |
1.5 ns
|
1.9 ns
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
JESD-609 Code |
e1
|
|
Length |
17 mm
|
17 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
990
|
1452
|
Number of Equivalent Gates |
16000
|
24000
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
990 CLBS, 16000 GATES
|
1452 CLBS, 24000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.7 mm
|
1.68 mm
|
Supply Voltage-Max |
2.625 V
|
2.75 V
|
Supply Voltage-Min |
2.375 V
|
2.25 V
|
Supply Voltage-Nom |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
17 mm
|
17 mm
|
Base Number Matches |
1
|
1
|
HTS Code |
|
8542.39.00.01
|
Number of Inputs |
|
180
|
Number of Logic Cells |
|
1452
|
Number of Outputs |
|
180
|
Package Equivalence Code |
|
BGA256,16X16,40
|
|
|
|
Compare A54SX16A-FGG256A with alternatives
Compare A54SX16A-FFG256I with alternatives