A54SX16A-FGG256A
vs
A54SX16A-3FG256
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROSEMI SOC PRODUCTS GROUP
|
MICROSEMI CORP
|
| Part Package Code |
BGA
|
|
| Package Description |
LBGA,
|
,
|
| Pin Count |
256
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| Additional Feature |
ALSO REQUIRES AN SUPPLU OF 3.3V
|
|
| Combinatorial Delay of a CLB-Max |
1.5 ns
|
|
| JESD-30 Code |
S-PBGA-B256
|
|
| JESD-609 Code |
e1
|
|
| Length |
17 mm
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of CLBs |
990
|
|
| Number of Equivalent Gates |
16000
|
|
| Number of Terminals |
256
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
990 CLBS, 16000 GATES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LBGA
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.7 mm
|
|
| Supply Voltage-Max |
2.625 V
|
|
| Supply Voltage-Min |
2.375 V
|
|
| Supply Voltage-Nom |
2.5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
1 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
17 mm
|
|
| Base Number Matches |
2
|
2
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
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