A54SX16A-FGG256A
vs
A54SX16A-FGG256I
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI SOC PRODUCTS GROUP
|
Reach Compliance Code |
compliant
|
compliant
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Base Number Matches |
2
|
2
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
BGA
|
Package Description |
|
LBGA,
|
Pin Count |
|
256
|
Additional Feature |
|
16000 TYPICAL GATES AVAILABLE
|
Combinatorial Delay of a CLB-Max |
|
1.4 ns
|
JESD-30 Code |
|
S-PBGA-B256
|
JESD-609 Code |
|
e1
|
Length |
|
17 mm
|
Moisture Sensitivity Level |
|
3
|
Number of CLBs |
|
1452
|
Number of Equivalent Gates |
|
24000
|
Number of Terminals |
|
256
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
|
1452 CLBS, 24000 GATES
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
LBGA
|
Package Shape |
|
SQUARE
|
Package Style |
|
GRID ARRAY, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
1.68 mm
|
Supply Voltage-Max |
|
2.75 V
|
Supply Voltage-Min |
|
2.25 V
|
Supply Voltage-Nom |
|
2.5 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
TIN SILVER COPPER
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
1 mm
|
Terminal Position |
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
Width |
|
17 mm
|
|
|
|
Compare A54SX16A-FGG256I with alternatives