A54SX16A-PQ208A
vs
A54SX32-2BGG313PP
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROSEMI SOC PRODUCTS GROUP
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
QFP
|
|
Package Description |
FQFP,
|
PLASTIC, MO-151, BGA-313
|
Pin Count |
208
|
|
Reach Compliance Code |
compliant
|
compliant
|
Additional Feature |
ALSO REQUIRES AN SUPPLU OF 3.3V
|
|
Combinatorial Delay of a CLB-Max |
1.5 ns
|
0.7 ns
|
JESD-30 Code |
S-PQFP-G208
|
S-PBGA-B313
|
JESD-609 Code |
e0
|
e1
|
Length |
28 mm
|
35 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
990
|
2880
|
Number of Equivalent Gates |
16000
|
32000
|
Number of Terminals |
208
|
313
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
990 CLBS, 16000 GATES
|
2880 CLBS, 32000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FQFP
|
IBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, FINE PITCH
|
GRID ARRAY, INTERSTITIAL PITCH
|
Peak Reflow Temperature (Cel) |
225
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.1 mm
|
2.52 mm
|
Supply Voltage-Max |
2.625 V
|
3.6 V
|
Supply Voltage-Min |
2.375 V
|
3 V
|
Supply Voltage-Nom |
2.5 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
|
Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.5 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
28 mm
|
35 mm
|
Base Number Matches |
1
|
1
|
HTS Code |
|
8542.39.00.01
|
Clock Frequency-Max |
|
320 MHz
|
Number of Inputs |
|
249
|
Number of Logic Cells |
|
2880
|
Number of Outputs |
|
249
|
Package Equivalence Code |
|
BGA313,25X25,50
|
|
|
|
Compare A54SX16A-PQ208A with alternatives
Compare A54SX32-2BGG313PP with alternatives