A54SX16APQ208I vs A54SX16PPQ208PP feature comparison

A54SX16APQ208I Microsemi FPGA & SoC

Buy Now Datasheet

A54SX16PPQ208PP Microsemi Corporation

Buy Now Datasheet
Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICROSEMI SOC PRODUCTS GROUP MICROSEMI CORP
Part Package Code QFP
Package Description FQFP, QFP208,1.2SQ FQFP,
Pin Count 208
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 16000 TYPICAL GATES AVAILABLE
Clock Frequency-Max 227 MHz 240 MHz
Combinatorial Delay of a CLB-Max 1.4 ns 0.9 ns
JESD-30 Code S-PQFP-G208 S-PQFP-G208
JESD-609 Code e0 e0
Length 28 mm 28 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1452 1452
Number of Equivalent Gates 24000 16000
Number of Inputs 175
Number of Logic Cells 1452
Number of Outputs 175
Number of Terminals 208 208
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 1452 CLBS, 24000 GATES 1452 CLBS, 16000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP FQFP
Package Equivalence Code QFP208,1.2SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH FLATPACK, FINE PITCH
Peak Reflow Temperature (Cel) 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.1 mm 4.1 mm
Supply Voltage-Max 2.75 V
Supply Voltage-Min 2.25 V
Supply Voltage-Nom 2.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 20
Width 28 mm 28 mm
Base Number Matches 1 1

Compare A54SX16APQ208I with alternatives

Compare A54SX16PPQ208PP with alternatives