A54SX32-1BG313PP
vs
A54SX16P-2PQ208
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI SOC PRODUCTS GROUP
|
Package Description |
PLASTIC, MO-151, BGA-313
|
FQFP,
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
280 MHz
|
320 MHz
|
Combinatorial Delay of a CLB-Max |
0.8 ns
|
0.7 ns
|
JESD-30 Code |
S-PBGA-B313
|
S-PQFP-G208
|
JESD-609 Code |
e0
|
e0
|
Length |
35 mm
|
28 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
2880
|
1452
|
Number of Equivalent Gates |
32000
|
16000
|
Number of Inputs |
249
|
175
|
Number of Logic Cells |
2880
|
|
Number of Outputs |
249
|
175
|
Number of Terminals |
313
|
208
|
Organization |
2880 CLBS, 32000 GATES
|
1452 CLBS, 16000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
IBGA
|
FQFP
|
Package Equivalence Code |
BGA313,25X25,50
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, INTERSTITIAL PITCH
|
FLATPACK, FINE PITCH
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.52 mm
|
4.1 mm
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Width |
35 mm
|
28 mm
|
Base Number Matches |
3
|
2
|
Pbfree Code |
|
No
|
Part Package Code |
|
QFP
|
Pin Count |
|
208
|
Additional Feature |
|
CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE
|
Operating Temperature-Max |
|
70 °C
|
Operating Temperature-Min |
|
|
Temperature Grade |
|
COMMERCIAL
|
|
|
|
Compare A54SX32-1BG313PP with alternatives
Compare A54SX16P-2PQ208 with alternatives