A54SX32-1BG313PP
vs
A54SX32-1BGG313I
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Package Description |
PLASTIC, MO-151, BGA-313
|
BGA, BGA313,25X25,50
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Clock Frequency-Max |
280 MHz
|
280 MHz
|
| Combinatorial Delay of a CLB-Max |
0.8 ns
|
0.8 ns
|
| JESD-30 Code |
S-PBGA-B313
|
S-PBGA-B313
|
| JESD-609 Code |
e0
|
e1
|
| Length |
35 mm
|
35 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
2880
|
2880
|
| Number of Equivalent Gates |
32000
|
32000
|
| Number of Inputs |
249
|
249
|
| Number of Logic Cells |
2880
|
2880
|
| Number of Outputs |
249
|
249
|
| Number of Terminals |
313
|
313
|
| Organization |
2880 CLBS, 32000 GATES
|
2880 CLBS, 32000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
IBGA
|
BGA
|
| Package Equivalence Code |
BGA313,25X25,50
|
BGA313,25X25,50
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, INTERSTITIAL PITCH
|
GRID ARRAY
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.52 mm
|
2.52 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
35 mm
|
35 mm
|
| Base Number Matches |
3
|
3
|
| Additional Feature |
|
CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Temperature Grade |
|
INDUSTRIAL
|
|
|
|
Compare A54SX32-1BG313PP with alternatives
Compare A54SX32-1BGG313I with alternatives