A54SX32A-1FG256I vs A54SX32A-FG256A feature comparison

A54SX32A-1FG256I Microchip Technology Inc

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A54SX32A-FG256A Microsemi FPGA & SoC

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Rohs Code No No
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI SOC PRODUCTS GROUP
Package Description 1 MM PITCH, FBGA-256 LBGA,
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01
Factory Lead Time 10 Weeks
Additional Feature 32000 TYPICAL GATES AVAILABLE ALSO REQUIRES AN SUPPLU OF 3.3V
Clock Frequency-Max 278 MHz
Combinatorial Delay of a CLB-Max 1.1 ns 1.5 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B256
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2880 1980
Number of Equivalent Gates 48000 32000
Number of Inputs 203
Number of Logic Cells 2880
Number of Outputs 203
Number of Terminals 256 256
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2880 CLBS, 48000 GATES 1980 CLBS, 32000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Packing Method TRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.97 mm 1.7 mm
Supply Voltage-Max 2.75 V 2.625 V
Supply Voltage-Min 2.25 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 17 mm 17 mm
Base Number Matches 3 2
Pbfree Code No
Part Package Code BGA
Pin Count 256
JESD-609 Code e0
Peak Reflow Temperature (Cel) 225
Terminal Finish TIN LEAD/TIN LEAD SILVER
Time@Peak Reflow Temperature-Max (s) 30

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Compare A54SX32A-FG256A with alternatives