A54SX32A-FG256A vs A54SX32A-1FGG256 feature comparison

A54SX32A-FG256A Microsemi FPGA & SoC

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A54SX32A-1FGG256 Microsemi Corporation

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROSEMI SOC PRODUCTS GROUP MICROSEMI CORP
Part Package Code BGA
Package Description LBGA, BGA, BGA256,16X16,40
Pin Count 256
Reach Compliance Code compliant compliant
Additional Feature ALSO REQUIRES AN SUPPLU OF 3.3V 32000 TYPICAL GATES AVAILABLE
Combinatorial Delay of a CLB-Max 1.5 ns 1.1 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e1
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1980 2880
Number of Equivalent Gates 32000 48000
Number of Terminals 256 256
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -40 °C
Organization 1980 CLBS, 32000 GATES 2880 CLBS, 48000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Peak Reflow Temperature (Cel) 225 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.97 mm
Supply Voltage-Max 2.625 V 2.75 V
Supply Voltage-Min 2.375 V 2.25 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE COMMERCIAL
Terminal Finish TIN LEAD/TIN LEAD SILVER Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 17 mm 17 mm
Base Number Matches 2 3
HTS Code 8542.39.00.01
Clock Frequency-Max 278 MHz
Number of Inputs 203
Number of Logic Cells 2880
Number of Outputs 203
Package Equivalence Code BGA256,16X16,40

Compare A54SX32A-FG256A with alternatives

Compare A54SX32A-1FGG256 with alternatives