AD8506ACBZ
vs
AD8506ARMZ-REEL
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
BGA
|
TSSOP
|
| Package Description |
VFBGA,
|
ROHS COMPLIANT, MO-187AA, MSOP-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.33.00.01
|
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.0006 µA
|
0.0006 µA
|
| Common-mode Reject Ratio-Nom |
105 dB
|
105 dB
|
| Input Offset Voltage-Max |
4000 µV
|
3500 µV
|
| JESD-30 Code |
R-PBGA-B8
|
S-PDSO-G8
|
| JESD-609 Code |
e1
|
e3
|
| Length |
1.775 mm
|
3 mm
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
TSSOP
|
| Package Equivalence Code |
BGA8,3X3,20
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
0.675 mm
|
1.1 mm
|
| Slew Rate-Nom |
0.012 V/us
|
0.013 V/us
|
| Supply Voltage Limit-Max |
6 V
|
5.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
TIN SILVER COPPER
|
MATTE TIN
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Unity Gain BW-Nom |
150
|
95
|
| Width |
1.43 mm
|
3 mm
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
Yes
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Technology |
|
CMOS
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare AD8506ACBZ with alternatives
Compare AD8506ARMZ-REEL with alternatives