AD8691WAUJZ-R7
vs
MCP6H81-E/MNY
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
TSOT
|
|
| Package Description |
VSSOP,
|
HVSON,
|
| Pin Count |
5
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.00026 µA
|
|
| Common-mode Reject Ratio-Nom |
95 dB
|
100 dB
|
| Input Offset Voltage-Max |
3000 µV
|
4000 µV
|
| JESD-30 Code |
R-PDSO-G5
|
R-PDSO-N8
|
| JESD-609 Code |
e3
|
|
| Length |
2.9 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
5
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VSSOP
|
HVSON
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Seated Height-Max |
1 mm
|
0.8 mm
|
| Slew Rate-Nom |
5 V/us
|
5 V/us
|
| Supply Voltage Limit-Max |
6 V
|
13 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.95 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Unity Gain BW-Nom |
10000
|
5500
|
| Width |
1.6 mm
|
2 mm
|
| Base Number Matches |
2
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.33.00.01
|
|
|
|
Compare AD8691WAUJZ-R7 with alternatives
Compare MCP6H81-E/MNY with alternatives