ADC0838CCWM
vs
ADC08038BIWM
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
PLASTIC, SO-20
|
SOP, SOP20,.4
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Input Voltage-Max |
5.05 V
|
6.8 V
|
| Analog Input Voltage-Min |
-0.05 V
|
-0.3 V
|
| Conversion Time-Max |
32 µs
|
8 µs
|
| Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
| JESD-609 Code |
e0
|
e0
|
| Length |
12.8 mm
|
12.8 mm
|
| Linearity Error-Max (EL) |
0.3906%
|
0.2%
|
| Moisture Sensitivity Level |
2A
|
|
| Number of Analog In Channels |
8
|
8
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Bit Code |
BINARY
|
BINARY
|
| Output Format |
SERIAL
|
SERIAL
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP20,.4
|
SOP20,.4
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
220
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
2.65 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
7.5 mm
|
7.5 mm
|
| Base Number Matches |
2
|
2
|
| Sample and Hold / Track and Hold |
|
TRACK
|
| Supply Current-Max |
|
3 mA
|
|
|
|
Compare ADC0838CCWM with alternatives
Compare ADC08038BIWM with alternatives