ADC1061CIN/NOPB
vs
ML2271CCP
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
MICRO LINEAR CORP
|
Package Description |
DIP, DIP20,.3
|
DIP, DIP20,.3
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
|
Analog Input Voltage-Max |
5.55 V
|
5 V
|
Analog Input Voltage-Min |
-0.05 V
|
|
Conversion Time-Max |
1.8 µs
|
1.9 µs
|
Converter Type |
ADC, FLASH METHOD
|
ADC, FLASH METHOD
|
JESD-30 Code |
R-PDIP-T20
|
R-PDIP-T20
|
JESD-609 Code |
e3
|
e0
|
Length |
26.075 mm
|
25.97 mm
|
Linearity Error-Max (EL) |
0.1465%
|
0.0977%
|
Moisture Sensitivity Level |
1
|
|
Number of Analog In Channels |
1
|
1
|
Number of Bits |
10
|
10
|
Number of Functions |
1
|
1
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Output Bit Code |
BINARY
|
BINARY
|
Output Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP20,.3
|
DIP20,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Sample and Hold / Track and Hold |
TRACK
|
SAMPLE
|
Seated Height-Max |
5.08 mm
|
4.32 mm
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
Matte Tin (Sn)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
7.62 mm
|
7.62 mm
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
DIP
|
Pin Count |
|
20
|
Supply Current-Max |
|
32 mA
|
|
|
|
Compare ADC1061CIN/NOPB with alternatives
Compare ML2271CCP with alternatives