ADF41020BCPZ
vs
LTC6951IUHF#PBF
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
LINEAR TECHNOLOGY CORP
|
| Package Description |
LFCSP-20
|
QFN-40
|
| Pin Count |
20
|
40
|
| Manufacturer Package Code |
CP-20-6
|
UHF
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Samacsys Manufacturer |
Analog Devices
|
|
| Analog IC - Other Type |
PLL FREQUENCY SYNTHESIZER
|
PLL FREQUENCY SYNTHESIZER
|
| JESD-30 Code |
S-XQCC-N20
|
R-PQCC-N40
|
| JESD-609 Code |
e3
|
e3
|
| Length |
4 mm
|
7 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
40
|
| Operating Temperature-Max |
85 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC20,.16SQ,20
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Supply Current-Max (Isup) |
30 mA
|
|
| Supply Voltage-Max (Vsup) |
3.15 V
|
3.45 V
|
| Supply Voltage-Min (Vsup) |
2.85 V
|
3.15 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
4 mm
|
5 mm
|
| Base Number Matches |
1
|
2
|
| Part Package Code |
|
QFN
|
| Date Of Intro |
|
2016-02-25
|
| Technology |
|
CMOS
|
|
|
|
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