ADN2807ACP
vs
ADN2807ACPZ-RL
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Not Recommended
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
7 X 7 MM, MO-220-VKKD-2, LFCSP-48
|
HVQCCN, LCC48,.27SQ,20
|
| Pin Count |
48
|
48
|
| Manufacturer Package Code |
CP-48-1
|
CP-48-1
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
5A991.B.3
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Applications |
SDH; SONET
|
SDH; SONET
|
| JESD-30 Code |
S-XQCC-N48
|
S-XQCC-N48
|
| JESD-609 Code |
e0
|
e3
|
| Length |
7 mm
|
7 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
48
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC48,.27SQ,20
|
LCC48,.27SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
240
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Current-Max |
0.215 mA
|
0.215 mA
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT
|
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
7 mm
|
7 mm
|
| Base Number Matches |
3
|
1
|
| Technology |
|
BIPOLAR
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare ADN2807ACP with alternatives
Compare ADN2807ACPZ-RL with alternatives