ADUM1400ARWZ
vs
HCPL-900J-000E
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
BROADCOM INC
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOIC-16
|
SOP, SOP16,.4
|
| Pin Count |
16
|
|
| Manufacturer Package Code |
RW-16
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8543.70.99.60
|
8542.39.00.01
|
| Samacsys Manufacturer |
Analog Devices
|
Avago Technologies
|
| Interface IC Type |
INTERFACE CIRCUIT
|
DIGITAL ISOLATOR
|
| Interface Standard |
EIA-232; EIA-422; EIA-485
|
GENERRAL PURPOSE
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| JESD-609 Code |
e3
|
e3
|
| Length |
10.3 mm
|
10.285 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
105 °C
|
100 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP16,.4
|
SOP16,.4
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
2.65 mm
|
2.67 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
2.7 V
|
3 V
|
| Supply Voltage-Nom |
3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
7.5 mm
|
7.505 mm
|
| Base Number Matches |
2
|
1
|
| Factory Lead Time |
|
18 Weeks
|
| Additional Feature |
|
ALSO OPERATED AT 5V SUPPLY
|
|
|
|
Compare ADUM1400ARWZ with alternatives
Compare HCPL-900J-000E with alternatives