ADV7842KBCZ-5
vs
AD9388ABSTZ-110
feature comparison
Pbfree Code |
No
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
Part Package Code |
BGA
|
QFP
|
Package Description |
17 X 17 MM, ROHS COMPLIANT, MO-192AAF-1, CSPBGA-256
|
LFQFP, QFP144,.87SQ,20
|
Pin Count |
256
|
144
|
Manufacturer Package Code |
BC-256-3
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Analog Devices
|
|
Additional Feature |
ALSO REQUIRES DIGITAL SUPPLY 1.75 TO 1.85V
|
IT ALSO REQUIRES 1.62V TO 1.98V SUPPLY
|
Consumer IC Type |
CONSUMER CIRCUIT
|
CONSUMER CIRCUIT
|
JESD-30 Code |
S-PBGA-B256
|
S-PQFP-G144
|
JESD-609 Code |
e1
|
e3
|
Length |
17 mm
|
20 mm
|
Moisture Sensitivity Level |
3
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
256
|
144
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
-10 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LFQFP
|
Package Equivalence Code |
BGA256,16X16,40
|
QFP144,.87SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.7 mm
|
1.6 mm
|
Supply Voltage-Max (Vsup) |
1.89 V
|
1.89 V
|
Supply Voltage-Min (Vsup) |
1.71 V
|
1.71 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
MATTE TIN
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
1 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
17 mm
|
20 mm
|
Base Number Matches |
2
|
2
|
Supply Current-Max |
|
284 mA
|
|
|
|
Compare ADV7842KBCZ-5 with alternatives
Compare AD9388ABSTZ-110 with alternatives