ADV7842KBCZ-5P
vs
AD9882KST-100
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
Part Package Code |
BGA
|
QFP
|
Package Description |
17 X 17 MM, ROHS COMPLIANT, MO-192AAF-1, CSPBGA-256
|
PLASTIC, MS-026BED, LQFP-100
|
Pin Count |
256
|
100
|
Manufacturer Package Code |
BC-256-3
|
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Analog Devices
|
|
Additional Feature |
ALSO REQUIRES DIGITAL SUPPLY 1.75 TO 1.85V
|
IT ALSO REQUIRES 2.2V TO 3.6V FOR OUTPUT
|
Consumer IC Type |
CONSUMER CIRCUIT
|
CONSUMER CIRCUIT
|
JESD-30 Code |
S-PBGA-B256
|
S-PQFP-G100
|
JESD-609 Code |
e1
|
e0
|
Length |
17 mm
|
14 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
256
|
100
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
-10 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LFQFP
|
Package Equivalence Code |
BGA256,16X16,40
|
QFP100,.63SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
240
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.7 mm
|
1.6 mm
|
Supply Voltage-Max (Vsup) |
1.89 V
|
3.45 V
|
Supply Voltage-Min (Vsup) |
1.71 V
|
3.15 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
|
TIN LEAD
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
1 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
17 mm
|
14 mm
|
Base Number Matches |
1
|
2
|
Supply Current-Max |
|
468 mA
|
|
|
|
Compare ADV7842KBCZ-5P with alternatives
Compare AD9882KST-100 with alternatives