AGL1000V5-CSG281I vs AGL125V5-FG144 feature comparison

AGL1000V5-CSG281I Microsemi Corporation

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AGL125V5-FG144 Microchip Technology Inc

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Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Package Description TFBGA, 13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Microsemi Corporation Microchip
Clock Frequency-Max 108 MHz
JESD-30 Code S-PBGA-B281 S-PBGA-B144
JESD-609 Code e1 e0
Length 10 mm 13 mm
Moisture Sensitivity Level 3 3
Number of CLBs 24576
Number of Equivalent Gates 1000000 125000
Number of Terminals 281 144
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 24576 CLBS, 1000000 GATES 125000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.05 mm 1.55 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD SILVER
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 10 mm 13 mm
Base Number Matches 2 4
Factory Lead Time 8 Weeks
Number of Inputs 97
Number of Logic Cells 3072
Number of Outputs 97
Package Equivalence Code BGA144,12X12,40

Compare AGL1000V5-CSG281I with alternatives

Compare AGL125V5-FG144 with alternatives