AGL400V2-CSG196
vs
AGL060V2-FGG144
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
8 X 8 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, CSP-196
|
13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-144
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
8 Weeks
|
|
Clock Frequency-Max |
108 MHz
|
108 MHz
|
JESD-30 Code |
S-PBGA-B196
|
S-PBGA-B144
|
Length |
8 mm
|
13 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Equivalent Gates |
400000
|
60000
|
Number of Inputs |
143
|
|
Number of Logic Cells |
9216
|
|
Number of Outputs |
143
|
|
Number of Terminals |
196
|
144
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
9126 CLBS, 400000 GATES
|
1536 CLBS, 60000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
LBGA
|
Package Equivalence Code |
BGA196,14X14,20
|
BGA144,12X12,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.55 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.14 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
COMMERCIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
8 mm
|
13 mm
|
Base Number Matches |
4
|
4
|
JESD-609 Code |
|
e1
|
Number of CLBs |
|
1536
|
Terminal Finish |
|
TIN SILVER COPPER
|
|
|
|
Compare AGL400V2-CSG196 with alternatives
Compare AGL060V2-FGG144 with alternatives