AGLN125V5-CSG81
vs
AGLN125V5-CSG81I
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
5 X 5 MM, 0.80 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, CSP-81
|
5 X 5 MM, 0.80 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, CSP-81
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
8 Weeks
|
8 Weeks
|
JESD-30 Code |
S-PBGA-B81
|
S-PBGA-B81
|
Length |
5 mm
|
5 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
3072
|
3072
|
Number of Equivalent Gates |
125000
|
125000
|
Number of Terminals |
81
|
81
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
-20 °C
|
-40 °C
|
Organization |
3072 CLBS, 125000 GATES
|
3072 CLBS, 125000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Equivalence Code |
BGA81,9X9,20
|
BGA81,9X9,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
5 mm
|
5 mm
|
Base Number Matches |
4
|
1
|
JESD-609 Code |
|
e1
|
Terminal Finish |
|
TIN SILVER COPPER
|
|
|
|
Compare AGLN125V5-CSG81 with alternatives
Compare AGLN125V5-CSG81I with alternatives