AHA4524A-031PTIG vs STULPI01BTBR feature comparison

AHA4524A-031PTIG Comtech AHA Corp

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STULPI01BTBR STMicroelectronics

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer COMTECH AHA CORP STMICROELECTRONICS
Part Package Code QFP BGA
Package Description TFQFP, 3.6 X 3.6 MM, ROHS COMPLIANT, MICRO TFBGA-36
Pin Count 64 36
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQFP-G64 S-PBGA-B36
Length 7 mm 3.6 mm
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 64 36
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFQFP TFBGA
Package Shape SQUARE SQUARE
Package Style FLATPACK, THIN PROFILE, FINE PITCH GRID ARRAY
Peak Reflow Temperature (Cel) 260 260
Seated Height-Max 1.2 mm 1.16 mm
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Telecom IC Type SUPPORT CIRCUIT SUPPORT CIRCUIT
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING BALL
Terminal Pitch 0.4 mm 0.5 mm
Terminal Position QUAD BOTTOM
Width 7 mm 3.6 mm
Base Number Matches 1 1
ECCN Code EAR99
Factory Lead Time 4 Weeks
Samacsys Manufacturer STMicroelectronics
JESD-609 Code e2
Qualification Status Not Qualified
Terminal Finish Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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