AM26C31QDBR
vs
DS96F174CMWC
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
SOIC
|
|
| Package Description |
SSOP, SSOP16,.3
|
DIE, WAFER
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Differential Output |
YES
|
YES
|
| Driver Number of Bits |
4
|
4
|
| High Level Input Current-Max |
0.000001 A
|
0.00002 A
|
| Input Characteristics |
STANDARD
|
STANDARD
|
| Interface IC Type |
LINE DRIVER
|
LINE DRIVER
|
| Interface Standard |
EIA-422-B; TIA-422-B; V.11
|
EIA-422; EIA-485
|
| JESD-30 Code |
R-PDSO-G16
|
X-XUUC-N
|
| Length |
6.2 mm
|
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
16
|
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Out Swing-Min |
2 V
|
1.5 V
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
SSOP
|
DIE
|
| Package Equivalence Code |
SSOP16,.3
|
WAFER
|
| Package Shape |
RECTANGULAR
|
UNSPECIFIED
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
UNCASED CHIP
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Receive Delay-Max |
|
|
| Seated Height-Max |
2 mm
|
|
| Supply Voltage-Max |
5.5 V
|
5.25 V
|
| Supply Voltage-Min |
4.5 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BIPOLAR
|
| Temperature Grade |
AUTOMOTIVE
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Transmit Delay-Max |
12 ns
|
16 ns
|
| Width |
5.3 mm
|
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare AM26C31QDBR with alternatives
Compare DS96F174CMWC with alternatives