AM26LS31/BEA
vs
DS96F174MMW8
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
CERAMIC, DIP-16
|
DIE, WAFER
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Differential Output |
YES
|
YES
|
| Driver Number of Bits |
4
|
4
|
| High Level Input Current-Max |
0.00002 A
|
0.00002 A
|
| Input Characteristics |
STANDARD
|
STANDARD
|
| Interface IC Type |
LINE DRIVER
|
LINE DRIVER
|
| Interface Standard |
EIA-422; FED STD 1020
|
EIA-422; EIA-485
|
| JESD-30 Code |
R-GDIP-T16
|
X-XUUC-N
|
| JESD-609 Code |
e0
|
|
| Length |
19.431 mm
|
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
16
|
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Out Swing-Min |
2 V
|
1.5 V
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
COMPLEMENTARY
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
UNSPECIFIED
|
| Package Code |
DIP
|
DIE
|
| Package Equivalence Code |
DIP16,.3
|
WAFER
|
| Package Shape |
RECTANGULAR
|
UNSPECIFIED
|
| Package Style |
IN-LINE
|
UNCASED CHIP
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Receive Delay-Max |
|
|
| Screening Level |
38535Q/M;38534H;883B
|
38535Q/M;38534H;883B
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Transmit Delay-Max |
30 ns
|
25 ns
|
| Width |
7.62 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare AM26LS31/BEA with alternatives
Compare DS96F174MMW8 with alternatives