AM26LS31CD vs DS96F174CMWC feature comparison

AM26LS31CD NXP Semiconductors

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DS96F174CMWC Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NATIONAL SEMICONDUCTOR CORP
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Differential Output YES YES
Driver Number of Bits 4 4
Input Characteristics STANDARD STANDARD
Interface IC Type LINE DRIVER LINE DRIVER
Interface Standard EIA-422; FED STD 1020 EIA-422; EIA-485
JESD-30 Code R-PDSO-G16 X-XUUC-N
Length 9.9 mm
Number of Functions 4 4
Number of Terminals 16
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Characteristics 3-STATE 3-STATE
Output Polarity COMPLEMENTARY
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code SOP DIE
Package Shape RECTANGULAR UNSPECIFIED
Package Style SMALL OUTLINE UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING NO LEAD
Terminal Pitch 1.27 mm
Terminal Position DUAL UPPER
Transmit Delay-Max 20 ns 16 ns
Width 3.9 mm
Base Number Matches 2 1
Package Description DIE, WAFER
High Level Input Current-Max 0.00002 A
Out Swing-Min 1.5 V
Package Equivalence Code WAFER
Receive Delay-Max

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