AM26LS32/BEA
vs
5962-9164001MFA
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
DIP-16
|
DFP, FL16,.3
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Interface IC Type |
LINE RECEIVER
|
LINE RECEIVER
|
| JESD-30 Code |
R-XDIP-T16
|
R-GDFP-F16
|
| JESD-609 Code |
e0
|
e0
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Low Current-Max |
0.008 A
|
0.006 A
|
| Package Body Material |
CERAMIC
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DFP
|
| Package Equivalence Code |
DIP16,.3
|
FL16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Receive Delay-Max |
38 ns
|
35 ns
|
| Screening Level |
38535Q/M;38534H;883B
|
MIL-STD-883
|
| Supply Current-Max |
70 mA
|
25 mA
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
TTL
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
FLAT
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
3
|
2
|
| Input Characteristics |
|
DIFFERENTIAL
|
| Interface Standard |
|
GENERAL PURPOSE
|
| Length |
|
9.6645 mm
|
| Number of Functions |
|
4
|
| Output Characteristics |
|
3-STATE
|
| Output Polarity |
|
TRUE
|
| Receiver Number of Bits |
|
4
|
| Seated Height-Max |
|
2.032 mm
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
4.5 V
|
| Width |
|
6.604 mm
|
|
|
|
Compare AM26LS32/BEA with alternatives
Compare 5962-9164001MFA with alternatives