AM26LS32BDMB vs AM26LS32BCN feature comparison

AM26LS32BDMB Rochester Electronics LLC

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AM26LS32BCN Philips Semiconductors

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Part Life Cycle Code Active Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS LLC PHILIPS SEMICONDUCTORS
Package Description DIP, DIP, DIP16,.3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Input Characteristics DIFFERENTIAL SCHMITT TRIGGER
Interface IC Type LINE RECEIVER LINE RECEIVER
Interface Standard V.10; V.11; EIA-422; EIA-423; FED STD 1020; FED STD 1030
JESD-30 Code R-GDIP-T16 R-PDIP-T16
Length 19.431 mm
Number of Functions 4
Number of Terminals 16 16
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Receive Delay-Max 26 ns 26 ns
Receiver Number of Bits 4
Seated Height-Max 5.08 mm
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm
Base Number Matches 2 3
Rohs Code No
JESD-609 Code e0
Output Low Current-Max 0.024 A
Package Equivalence Code DIP16,.3
Qualification Status Not Qualified
Supply Current-Max 70 mA
Terminal Finish Tin/Lead (Sn/Pb)

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