AM26LS32BIN
vs
AM26LS32BDMB
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
ROCHESTER ELECTRONICS LLC
|
| Package Description |
DIP, DIP16,.3
|
DIP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Interface IC Type |
LINE RECEIVER
|
LINE RECEIVER
|
| JESD-30 Code |
R-PDIP-T16
|
R-GDIP-T16
|
| JESD-609 Code |
e0
|
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Low Current-Max |
0.024 A
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
|
| Receive Delay-Max |
26 ns
|
26 ns
|
| Supply Current-Max |
70 mA
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
TTL
|
BIPOLAR
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
3
|
2
|
| Input Characteristics |
|
DIFFERENTIAL SCHMITT TRIGGER
|
| Interface Standard |
|
V.10; V.11; EIA-422; EIA-423; FED STD 1020; FED STD 1030
|
| Length |
|
19.431 mm
|
| Number of Functions |
|
4
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Receiver Number of Bits |
|
4
|
| Seated Height-Max |
|
5.08 mm
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
4.5 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
7.62 mm
|
|
|
|
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