AM29510DC vs 5962-8873302ZX feature comparison

AM29510DC AMD

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5962-8873302ZX LOGIC Devices Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC LOGIC DEVICES INC
Part Package Code DIP PGA
Package Description DIP, DIP64,.9 PGA, PGA68,11X11
Pin Count 64 68
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Boundary Scan NO NO
External Data Bus Width 16 16
JESD-30 Code R-CDIP-T64 S-XPGA-P68
JESD-609 Code e0
Length 81.28 mm
Low Power Mode NO NO
Number of Terminals 64 68
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Output Data Bus Width 35 35
Package Body Material CERAMIC, METAL-SEALED COFIRED UNSPECIFIED
Package Code DIP PGA
Package Equivalence Code DIP64,.9 PGA68,11X11
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 6.858 mm
Supply Current-Max 900 mA
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE PIN/PEG
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL PERPENDICULAR
Width 22.86 mm
uPs/uCs/Peripheral ICs Type DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
Base Number Matches 2 1
ECCN Code 3A001.A.2.C
Additional Feature 2 X 16 BIT DATA INPUT BUS; MULTIPLEXED OUTPUT
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 225
Screening Level MIL-STD-883

Compare AM29510DC with alternatives

Compare 5962-8873302ZX with alternatives