AM29LV640DU120RWHKN vs HY27UA161G1M-FPCS feature comparison

AM29LV640DU120RWHKN Spansion

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HY27UA161G1M-FPCS SK Hynix Inc

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC SK HYNIX INC
Part Package Code BGA BGA
Package Description 11 X 12 MM, 0.80 MM PITCH, FBGA-63 TFBGA, BGA63,8X12,32
Pin Count 63 63
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 120 ns 12000 ns
Boot Block BOTTOM/TOP
JESD-30 Code R-PBGA-B63 R-PBGA-B63
JESD-609 Code e1 e1
Length 12 mm 15 mm
Memory Density 67108864 bit 1073741824 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 63 63
Number of Words 4194304 words 67108864 words
Number of Words Code 4000000 64000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 4MX16 64MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3.3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE SLC NAND TYPE
Width 11 mm 8.5 mm
Base Number Matches 1 1
Command User Interface YES
Data Polling NO
Number of Sectors/Size 8K
Package Equivalence Code BGA63,8X12,32
Page Size 256 words
Ready/Busy YES
Sector Size 8K
Standby Current-Max 0.0001 A
Supply Current-Max 0.03 mA
Toggle Bit NO

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Compare HY27UA161G1M-FPCS with alternatives