AM54BDS128AGT89IT vs K5A3340YBC-T7550 feature comparison

AM54BDS128AGT89IT AMD

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K5A3340YBC-T7550 Samsung Semiconductor

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description LFBGA, BGA93,10X12,32 TFBGA,
Pin Count 93 69
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 85 ns
Additional Feature SRAM IS ORGANISED AS 1M X 16 SRAM IS ORGANIZED AS 512K X 8 / 256K X 16; NOR FLASH CAN ALSO BE ORGANIZED AS 4M X 8
JESD-30 Code S-PBGA-B93 R-PBGA-B69
Length 10 mm 11 mm
Memory Density 134217728 bit 33554432 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Mixed Memory Type FLASH+SRAM
Number of Functions 1 1
Number of Terminals 93 69
Number of Words 8388608 words 2097152 words
Number of Words Code 8000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA TFBGA
Package Equivalence Code BGA93,10X12,32
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.2 mm
Standby Current-Max 0.00001 A
Supply Current-Max 0.04 mA
Supply Voltage-Max (Vsup) 1.95 V 3.3 V
Supply Voltage-Min (Vsup) 1.65 V 2.7 V
Supply Voltage-Nom (Vsup) 1.8 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 10 mm 8 mm
Base Number Matches 2 1

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