AMPAL16R4PC
vs
PAL16L8A-2DMB
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
CYPRESS SEMICONDUCTOR CORP
|
| Package Description |
,
|
DIP, DIP20,.3
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Programmable Logic Type |
OT PLD
|
EE PLD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
No
|
| ECCN Code |
|
3A001.A.2.C
|
| Architecture |
|
PAL-TYPE
|
| JESD-30 Code |
|
R-XDIP-T20
|
| JESD-609 Code |
|
e0
|
| Number of Inputs |
|
16
|
| Number of Outputs |
|
8
|
| Number of Product Terms |
|
64
|
| Number of Terminals |
|
20
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Function |
|
COMBINATORIAL
|
| Package Body Material |
|
CERAMIC
|
| Package Code |
|
DIP
|
| Package Equivalence Code |
|
DIP20,.3
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
IN-LINE
|
| Propagation Delay |
|
40 ns
|
| Qualification Status |
|
Not Qualified
|
| Screening Level |
|
38535Q/M;38534H;883B
|
| Supply Voltage-Nom |
|
5 V
|
| Surface Mount |
|
NO
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
MILITARY
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Pitch |
|
2.54 mm
|
| Terminal Position |
|
DUAL
|
|
|
|
Compare AMPAL16R4PC with alternatives
Compare PAL16L8A-2DMB with alternatives