AMPAL20L8ADC vs GAL22V10-30LJM feature comparison

AMPAL20L8ADC AMD

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GAL22V10-30LJM National Semiconductor Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP
Package Description DIP, DIP24,.3 DIP, DIP24,.3
Pin Count 24
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Architecture PAL-TYPE PAL-TYPE
JESD-30 Code R-GDIP-T24 R-GDIP-T24
JESD-609 Code e0 e0
Number of Dedicated Inputs 14 11
Number of I/O Lines 6 10
Number of Inputs 20 22
Number of Outputs 8 10
Number of Product Terms 64 132
Number of Terminals 24 24
Operating Temperature-Max 75 °C 125 °C
Operating Temperature-Min -55 °C
Organization 14 DEDICATED INPUTS, 6 I/O 11 DEDICATED INPUTS, 10 I/O
Output Function COMBINATORIAL MACROCELL
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP24,.3 DIP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Programmable Logic Type OT PLD EE PLD
Propagation Delay 25 ns 30 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology TTL CMOS
Temperature Grade COMMERCIAL EXTENDED MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 2
ECCN Code 3A001.A.2.C
Clock Frequency-Max 22.2 MHz
Seated Height-Max 5.715 mm
Width 7.62 mm

Compare AMPAL20L8ADC with alternatives

Compare GAL22V10-30LJM with alternatives