AMPAL20L8ADC vs PAL16L8A-2DMB feature comparison

AMPAL20L8ADC AMD

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PAL16L8A-2DMB Cypress Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC CYPRESS SEMICONDUCTOR CORP
Part Package Code DIP
Package Description DIP, DIP24,.3 DIP, DIP20,.3
Pin Count 24
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Architecture PAL-TYPE PAL-TYPE
JESD-30 Code R-GDIP-T24 R-XDIP-T20
JESD-609 Code e0 e0
Number of Dedicated Inputs 14
Number of I/O Lines 6
Number of Inputs 20 16
Number of Outputs 8 8
Number of Product Terms 64 64
Number of Terminals 24 20
Operating Temperature-Max 75 °C 125 °C
Operating Temperature-Min -55 °C
Organization 14 DEDICATED INPUTS, 6 I/O
Output Function COMBINATORIAL COMBINATORIAL
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP24,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Programmable Logic Type OT PLD EE PLD
Propagation Delay 25 ns 40 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology TTL CMOS
Temperature Grade COMMERCIAL EXTENDED MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 1
ECCN Code 3A001.A.2.C
Screening Level 38535Q/M;38534H;883B

Compare AMPAL20L8ADC with alternatives

Compare PAL16L8A-2DMB with alternatives