AMPAL20R6BPC vs GAL22V10-30LJM feature comparison

AMPAL20R6BPC Rochester Electronics LLC

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GAL22V10-30LJM National Semiconductor Corporation

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NATIONAL SEMICONDUCTOR CORP
Package Description DIP, DIP, DIP24,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 37 MHz 22.2 MHz
JESD-30 Code R-PDIP-T24 R-GDIP-T24
JESD-609 Code e0 e0
Number of Dedicated Inputs 12 11
Number of I/O Lines 2 10
Number of Terminals 24 24
Operating Temperature-Max 75 °C 125 °C
Operating Temperature-Min -55 °C
Organization 12 DEDICATED INPUTS, 2 I/O 11 DEDICATED INPUTS, 10 I/O
Output Function MIXED MACROCELL
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Programmable Logic Type OT PLD EE PLD
Propagation Delay 18 ns 30 ns
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology TTL CMOS
Temperature Grade COMMERCIAL EXTENDED MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 2 2
Rohs Code No
ECCN Code 3A001.A.2.C
Architecture PAL-TYPE
Number of Inputs 22
Number of Outputs 10
Number of Product Terms 132
Package Equivalence Code DIP24,.3
Qualification Status Not Qualified
Seated Height-Max 5.715 mm
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare AMPAL20R6BPC with alternatives

Compare GAL22V10-30LJM with alternatives