AN5532
vs
TDA3653BU
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
PANASONIC CORP
|
NXP SEMICONDUCTORS
|
Part Package Code |
SFM
|
SFM
|
Package Description |
, SIP9,.07TB
|
POWER, PLASTIC, SOT-110-1, SIP-9
|
Pin Count |
9
|
9
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Application |
TV
|
|
Blanking Output |
NO
|
NO
|
Consumer IC Type |
VERTICAL DEFLECTION IC
|
VERTICAL DEFLECTION IC
|
JESD-30 Code |
R-PSFM-T9
|
R-PSFM-T9
|
Number of Functions |
1
|
1
|
Number of Terminals |
9
|
9
|
Operating Temperature-Max |
70 °C
|
150 °C
|
Operating Temperature-Min |
-20 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SIP
|
SIP
|
Package Equivalence Code |
SIP9,.07TB
|
SIP9,.1TB
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
NO
|
NO
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temperature Grade |
COMMERCIAL
|
OTHER
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
SINGLE
|
SINGLE
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Samacsys Manufacturer |
|
NXP
|
JESD-609 Code |
|
e3
|
Supply Voltage-Max (Vsup) |
|
60 V
|
Supply Voltage-Min (Vsup) |
|
10 V
|
Terminal Finish |
|
TIN
|
|
|
|
Compare AN5532 with alternatives
Compare TDA3653BU with alternatives