APA150-PQG208I
vs
APA150-PQG208I
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
FQFP, QFP208,1.2SQ,20
|
0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, QFP-208
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Microsemi Corporation
|
|
| Clock Frequency-Max |
180 MHz
|
180 MHz
|
| JESD-30 Code |
S-PQFP-G208
|
S-PQFP-G208
|
| JESD-609 Code |
e3
|
e3
|
| Length |
28 mm
|
28 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Equivalent Gates |
150000
|
150000
|
| Number of Inputs |
158
|
158
|
| Number of Logic Cells |
6144
|
6144
|
| Number of Outputs |
158
|
158
|
| Number of Terminals |
208
|
208
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
150000 GATES
|
150000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FQFP
|
FQFP
|
| Package Equivalence Code |
QFP208,1.2SQ,20
|
QFP208,1.2SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, FINE PITCH
|
FLATPACK, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
245
|
245
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.1 mm
|
4.1 mm
|
| Supply Voltage-Max |
2.7 V
|
2.7 V
|
| Supply Voltage-Min |
2.3 V
|
2.3 V
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
28 mm
|
28 mm
|
| Base Number Matches |
2
|
2
|
| Factory Lead Time |
|
18 Weeks
|
| Packing Method |
|
TRAY
|
|
|
|
Compare APA150-PQG208I with alternatives