APA300-FGG256
vs
APA300-FFG256X79
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
Package Description |
1 MM PITCH, ROHS COMPLIANT, FBGA-256
|
BGA,
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
18 Weeks
|
|
Samacsys Manufacturer |
Microchip
|
|
Clock Frequency-Max |
180 MHz
|
180 MHz
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
JESD-609 Code |
e1
|
|
Length |
17 mm
|
17 mm
|
Moisture Sensitivity Level |
3
|
|
Number of Equivalent Gates |
300000
|
300000
|
Number of Inputs |
186
|
186
|
Number of Logic Cells |
8192
|
|
Number of Outputs |
186
|
186
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
300000 GATES
|
300000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA256,16X16,40
|
BGA256,16X16,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Packing Method |
TRAY
|
|
Peak Reflow Temperature (Cel) |
250
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.8 mm
|
1.8 mm
|
Supply Voltage-Max |
2.7 V
|
2.7 V
|
Supply Voltage-Min |
2.3 V
|
2.3 V
|
Supply Voltage-Nom |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
17 mm
|
17 mm
|
Base Number Matches |
6
|
1
|
|
|
|
Compare APA300-FGG256 with alternatives
Compare APA300-FFG256X79 with alternatives