APA600-FG676
vs
APA600-FG676I
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
1 MM PITCH, FBGA-676
|
1 MM PITCH, FBGA-676
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
18 Weeks
|
18 Weeks
|
| Clock Frequency-Max |
180 MHz
|
180 MHz
|
| JESD-30 Code |
S-PBGA-B676
|
S-PBGA-B676
|
| JESD-609 Code |
e0
|
e0
|
| Length |
27 mm
|
27 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Equivalent Gates |
600000
|
600000
|
| Number of Inputs |
454
|
454
|
| Number of Logic Cells |
21504
|
21504
|
| Number of Outputs |
454
|
454
|
| Number of Terminals |
676
|
676
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
600000 GATES
|
600000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA676,26X26,40
|
BGA676,26X26,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Packing Method |
TRAY
|
TRAY
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.44 mm
|
2.44 mm
|
| Supply Voltage-Max |
2.7 V
|
2.7 V
|
| Supply Voltage-Min |
2.3 V
|
2.3 V
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
27 mm
|
27 mm
|
| Base Number Matches |
7
|
2
|
| Samacsys Manufacturer |
|
Microchip
|
|
|
|
Compare APA600-FG676 with alternatives
Compare APA600-FG676I with alternatives