APT20M11JVR
vs
IXFR230N20T
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
LITTELFUSE INC
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
Factory Lead Time |
26 Weeks
|
|
Samacsys Manufacturer |
Microchip
|
LITTELFUSE
|
Additional Feature |
HIGH VOLTAGE
|
AVALANCHE RATED
|
Avalanche Energy Rating (Eas) |
3600 mJ
|
5000 mJ
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE WITH BUILT-IN DIODE
|
DS Breakdown Voltage-Min |
200 V
|
200 V
|
Drain Current-Max (ID) |
175 A
|
156 A
|
Drain-source On Resistance-Max |
0.011 Ω
|
0.008 Ω
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
JESD-30 Code |
R-PUFM-X4
|
R-PSIP-T3
|
Number of Elements |
1
|
1
|
Number of Terminals |
4
|
3
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Operating Temperature-Max |
150 °C
|
175 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLANGE MOUNT
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Pulsed Drain Current-Max (IDM) |
700 A
|
630 A
|
Qualification Status |
Not Qualified
|
|
Surface Mount |
NO
|
NO
|
Terminal Form |
UNSPECIFIED
|
THROUGH-HOLE
|
Terminal Position |
UPPER
|
SINGLE
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
10
|
Transistor Application |
SWITCHING
|
SWITCHING
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
1
|
1
|
Feedback Cap-Max (Crss) |
|
60 pF
|
JESD-609 Code |
|
e1
|
Operating Temperature-Min |
|
-55 °C
|
Power Dissipation-Max (Abs) |
|
600 W
|
Reference Standard |
|
UL RECOGNIZED
|
Terminal Finish |
|
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
|
|
|
|
Compare APT20M11JVR with alternatives
Compare IXFR230N20T with alternatives