APT38N60SC6
vs
TK39N60W5
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
TOSHIBA CORP
|
| Reach Compliance Code |
compliant
|
unknown
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
Yes
|
| Package Description |
|
FLANGE MOUNT, R-PSFM-T3
|
| ECCN Code |
|
EAR99
|
| Factory Lead Time |
|
20 Weeks
|
| Samacsys Manufacturer |
|
Toshiba
|
| Avalanche Energy Rating (Eas) |
|
608 mJ
|
| Case Connection |
|
DRAIN
|
| Configuration |
|
SINGLE WITH BUILT-IN DIODE
|
| DS Breakdown Voltage-Min |
|
600 V
|
| Drain Current-Max (ID) |
|
38.8 A
|
| Drain-source On Resistance-Max |
|
0.074 Ω
|
| FET Technology |
|
METAL-OXIDE SEMICONDUCTOR
|
| JEDEC-95 Code |
|
TO-247
|
| JESD-30 Code |
|
R-PSFM-T3
|
| Number of Elements |
|
1
|
| Number of Terminals |
|
3
|
| Operating Mode |
|
ENHANCEMENT MODE
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
FLANGE MOUNT
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Polarity/Channel Type |
|
N-CHANNEL
|
| Pulsed Drain Current-Max (IDM) |
|
155 A
|
| Surface Mount |
|
NO
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Position |
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Transistor Application |
|
SWITCHING
|
| Transistor Element Material |
|
SILICON
|
|
|
|
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