APTGT20DDA60T3G
vs
APTGT20DDA60T3
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
Package Description |
ROHS COMPLIANT, SP3, 25 PIN
|
MODULE-25
|
Pin Count |
25
|
25
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
Additional Feature |
AVALANCHE RATED
|
|
Case Connection |
ISOLATED
|
ISOLATED
|
Collector Current-Max (IC) |
32 A
|
32 A
|
Collector-Emitter Voltage-Max |
600 V
|
600 V
|
Configuration |
COMMON COLLECTOR, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR
|
COMMON COLLECTOR, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR
|
Gate-Emitter Voltage-Max |
20 V
|
|
JESD-30 Code |
R-XUFM-X25
|
R-XUFM-X25
|
JESD-609 Code |
e1
|
e0
|
Moisture Sensitivity Level |
1
|
|
Number of Elements |
2
|
2
|
Number of Terminals |
25
|
25
|
Operating Temperature-Max |
175 °C
|
175 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Power Dissipation-Max (Abs) |
62 W
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
NO
|
NO
|
Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
Terminal Form |
UNSPECIFIED
|
UNSPECIFIED
|
Terminal Position |
UPPER
|
UPPER
|
Transistor Application |
POWER CONTROL
|
POWER CONTROL
|
Transistor Element Material |
SILICON
|
SILICON
|
Turn-off Time-Nom (toff) |
310 ns
|
310 ns
|
Turn-on Time-Nom (ton) |
170 ns
|
170 ns
|
VCEsat-Max |
1.9 V
|
|
Base Number Matches |
1
|
2
|
Pbfree Code |
|
No
|
Part Package Code |
|
MODULE
|
|
|
|