APTM50AM38FTG
vs
APTM50AM38STG
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MICROSEMI CORP
|
ADVANCED POWER TECHNOLOGY INC
|
Part Package Code |
MODULE
|
|
Package Description |
ROHS COMPLIANT, MODULE-12
|
|
Pin Count |
12
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
Samacsys Manufacturer |
Microsemi Corporation
|
|
Additional Feature |
AVALANCHE RATED
|
|
Avalanche Energy Rating (Eas) |
2500 mJ
|
|
Case Connection |
ISOLATED
|
|
Configuration |
SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR
|
|
DS Breakdown Voltage-Min |
500 V
|
|
Drain Current-Max (ID) |
90 A
|
|
Drain-source On Resistance-Max |
0.038 Ω
|
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
|
JESD-30 Code |
R-XUFM-X12
|
|
JESD-609 Code |
e1
|
|
Moisture Sensitivity Level |
1
|
|
Number of Elements |
2
|
|
Number of Terminals |
12
|
|
Operating Mode |
ENHANCEMENT MODE
|
|
Operating Temperature-Max |
150 °C
|
|
Package Body Material |
UNSPECIFIED
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
FLANGE MOUNT
|
|
Polarity/Channel Type |
N-CHANNEL
|
|
Pulsed Drain Current-Max (IDM) |
360 A
|
|
Qualification Status |
Not Qualified
|
|
Surface Mount |
NO
|
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
UNSPECIFIED
|
|
Terminal Position |
UPPER
|
|
Transistor Application |
SWITCHING
|
|
Transistor Element Material |
SILICON
|
|
Base Number Matches |
2
|
3
|
|
|
|
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