AR02BPC3Y9762N
vs
RP73F1E97K6BTDF
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Contact Manufacturer
|
Active
|
| Ihs Manufacturer |
TOKEN ELECTRONICS INDUSTRY CO LTD
|
TE CONNECTIVITY LTD
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Construction |
Chip
|
Rectangular
|
| JESD-609 Code |
e3
|
e3
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
155 °C
|
155 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.3 mm
|
0.3 mm
|
| Package Length |
1 mm
|
1 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
0.5 mm
|
0.5 mm
|
| Packing Method |
Bulk
|
TR, PAPER, 7 INCH
|
| Rated Power Dissipation (P) |
0.0625 W
|
0.063 W
|
| Resistance |
97600 Ω
|
97600 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Series |
AR
|
|
| Size Code |
0402
|
0402
|
| Technology |
THIN FILM
|
THIN FILM
|
| Temperature Coefficient |
25 ppm/°C
|
25 ppm/°C
|
| Terminal Finish |
Tin (Sn) - with Nickel (Ni) barrier
|
Matte Tin (Sn) - with Nickel (Ni) barrier
|
| Tolerance |
0.1%
|
0.1%
|
| Working Voltage |
25 V
|
25 V
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
CHIP
|
| HTS Code |
|
8533.21.00.30
|
| Additional Feature |
|
HIGH PRECISION
|
| Mounting Feature |
|
SURFACE MOUNT
|
| Package Shape |
|
RECTANGULAR PACKAGE
|
| Rated Temperature |
|
70 °C
|
| Reference Standard |
|
MIL-STD-202
|
| Surface Mount |
|
YES
|
| Terminal Shape |
|
WRAPAROUND
|
|
|
|
Compare AR02BPC3Y9762N with alternatives
Compare RP73F1E97K6BTDF with alternatives